MAX19790ETX+T【PDF 2/11 页】IC 250MHZ

250MHz to 4000MHz Dual,

Analog Voltage Variable Attenuator

2

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

V

CC

to GND ..........................................................-0.3V to +5.5V

CTRL to GND (with V

CC

= +5.0V applied) ............0V to +4.75V

All Other Pins to GND .............................. -0.3V to (V

CC

+ 0.3V)

RF Input .........................................................................+20dBm

Current into CTRL Pin (V

CC

grounded) .............................40mA

Maximum Junction Temperature .....................................+150癈

Operating Temperature Range ..........................-40癈 to +85癈

Storage Temperature Range ........................&.-65癈 to +150癈

Continuous Power Dissipation (T

C

= +85癈) (Note 1) .......2.1W

?/DIV>

JC

(Notes 2, 4) ............................................................ +10癈/W

?/DIV>

JA

(Notes 3, 4) ............................................................ +35癈/W

Lead Temperature (soldering, 10s) ................................+300癈

Soldering Temperature (reflow) ......................................+260癈

DC ELECTRICAL CHARACTERISTICS

(V

CC

= +4.75V to +5.25V, V

CTRL

= +1.0V to +4.0V, no RF signals applied, all input and output ports terminated with 50I, T

C

=

-40癈 to +85癈, unless otherwise noted. Typical values are at V

CC

= +5.0V, V

CTRL

= +1.0V, T

C

= +25癈, unless otherwise noted.)

RECOMMENDED AC OPERATING CONDITIONS

ABSOLuTE MAxIMuM RATINGS

Note 1: T

C

is the temperature on the exposed pad of the package. T

A

is the ambient temperature of the device and PCB.

Note 2: Based on junction temperature T

J

= T

C

+ (?/DIV>

JC

x V

CC

x I

CC

). This formula can be used when the temperature of the exposed

pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction

temperature must not exceed +150癈.

Note 3: Junction temperature T

J

= T

A

+ (?/DIV>

JA

x V

CC

x I

CC

). This formula can be used when the ambient temperature of the PCB is

known. The junction temperature must not exceed +150癈.

Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

CAUTION! ESD SENSITIVE DEVICE

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAx

uNITS

SuPPLY

Supply Voltage

V

CC

4.75

5.0

5.25

V

Supply Current

I

CC

7.3

9.5

mA

CONTROL INPuT

Control Voltage Range

V

CTRL

(Note 5)

1.0

4.0

V

Control Input Resistance

R

CTRL

50

kI

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAx

uNITS

RF Frequency Range

f

RF

(Note 6)

250

4000

MHz

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